摘要 |
The invention relates to compounds of formulas, 3874 H1, empiric formula: C58H86N2O18, MW 1099,3 3874 H2, empiric formula: C59H88N2O18, MW 1113,3 3874 H3, empiric formula: C57H87NO18, MW 1074,3 3874 H4, empiric formula: C58H84N2O18, MW 1097,3 3874 H5, empiric formula: C59H86N2O18, MW 1111,3 3874 H6, empiric formula: C57H85NO18, MW 1072,3, they are adequate for treatment of illnesses caused by fungus and for treatment of diseases accompanied by increased concentration of steroids.
|