发明名称 Substrate for printed circuit
摘要 <p>In a substrate of a printed circuit, a metal foil is mounted onto at least one of the outermost surfaces of a laminate made of a plurality of glass fiber woven fabrics impregnated with synthetic resin, and heated and pressed. Warps and wefts of the glass fiber fabrics filamentated their filaments. The synthetic resin enters gaps among the opening filaments so that the vertically laminated glass fiber fabrics including the opening fibers are integrally jointed with each other. Warps and wefts of the glass fiber fabrics may have their surfaces made fuzzy so that the synthetic resin enters fuzzy filaments. Furthermore, the thus produced substrate may be used as a multilayer printed circuit substrate.</p>
申请公布号 HK1000336(A1) 申请公布日期 1998.02.27
申请号 HK19970101896 申请日期 1997.10.07
申请人 NITTO BOSEKI CO. LTD. 发明人 KASEI SHIN;WAKETA HIDEHARU;KATO KEIICHI;KAWAGUCHI YUTAKA
分类号 H05K3/46;H05K1/03;(IPC1-7):H05K;B29B 主分类号 H05K3/46
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