发明名称 METHOD AND APPARATUS FOR ORIENTING MINIATURE COMPONENTS
摘要 <p>An electronic component preprocessing assembly comprises a press pin plate (28) having a surface from which at least one press pin (30) depends, a load plate (34) having at least one loading aperture (132) spatially aligned with and sized to receive the press pin (30), a pin holder plate (40) having a surface from which at least one orienting pin (42) depends, and a carrier plate (38) having at least one component passageway (134) spatially aligned with and sized to receive the orienting pin (42). The load plate (34) and the carrier plate (38) are spatially aligned so that an electronic component (32) initially placed in the loading aperture (132) can travel to the component passageway (134) while captured within a predetermined distance between the press pin (30) and the orienting pin (42). The predetermined distance is preferably sufficient to prevent unneccessary pressure on the component (32) captured therein while orienting the component in a preferred orientation during transfer.</p>
申请公布号 WO9808368(A1) 申请公布日期 1998.02.26
申请号 WO1997US14405 申请日期 1997.08.15
申请人 ELECTRO SCIENTIFIC INDUSTRIES, INC. 发明人 GARCIA, DOUGLAS, J.
分类号 H05K3/30;B23P19/00;H05K13/02;H05K13/04;(IPC1-7):H05K13/04 主分类号 H05K3/30
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