| 摘要 |
Switching arrangement consists of a base plate (11), carrier plate(s) made of insulating ceramic (1) with Cu plating (2,7), semiconducting elements (3), auxiliary contacts (15), connecting elements (4), contact elements (5), and sealing cpd. (10). The switching structure, consisting of elements (3), contacts (15), elements (4) and (5) is connected to the structured Cu plating (2) of the ceramic (1) which had been coated with silicon adhesive (6). A sealing cpd. (10) completely covers the switching structure whilst the contact sites for external contacts are not covered. |
