Millimetre waveband arrangement for signal attenuation

摘要

The waveband arrangement includes conductive substrates (2), whose individual lines (2a) are coupled to a microwave chip (1). The substrates are located on opposite sides of the socket (4) top surface. The chip is covered and encapsulated by a lid (5) on the socket top surface. Waveguides (7), each with an input/output part (7a) contain an aperture (4a) passing through the socket upstream and downstream. A waveguide end section has its top part coupled to the input/output part. The waveguides are located near to the socket opposite ends. The conductive substrate lines are coupled to the waveguides by an E-plane probe. The conductive substrates cover the top surface apertures.