Vorrichtung zum Galvanisieren von elektronischen Leiterplatten oder dergleichen

摘要

A device for electroplating printed circuit boards, in particular those that contain a plurality of bores, has in a manner known per se a contact and transport system (5, 6) which moves the printed circuit boards connected to a negative electric potential and in a substantially horizontal position through a bath of electrolyte, past several anodes (7, 8) which follow each other in the direction of displacement. Each of these anodes (7, 8) which follow each other is associated to its own electroplating current source (41) whose output voltage can be independently adjusted. In operation, the positive potentials of the anodes (7, 8) that follow each other in the direction of displacement are connected to different potentials, and insofar as anodes are provided on opposite sides of the path of displacement of the printed circuit board, the positive potentials of directly opposite anodes (7, 8) are also connected to different potentials. The electronic printed circuit boards to be electroplated, in particular the outer surface of their bores to be electroplated, thus run through electric fields with different geometric designs, and so a possible lack of homogeneity of the individual field is largely compensated by moving the printed circuit boards through different inhomogeneous fields. Galvanically deposited metal layers with a largely constant thickness can thus be deposited on the outer surfaces of the bores over their whole axial extension.