Verfahren zum Verbinden eines Schaltkreissubstrates mit einem Halbleiterteil

摘要

A circuit substrate connection method for assuring to connect the semiconductor parts or sub-circuit substrate to a main circuit substrate such as liquid crystal display panel by avoiding a short between the electrodes on the same substrate. In the present invention, photosensitive resin including conductive particulates is painted on the transparent circuit substrate, and a light is radiated from the bottom of the main circuit substrate. As the electrode of the circuit substrate shields the light, the conductive particulates are removed together with the photosensitive resin other than on the electrode by developing the main circuit substrate. Further, in the present invention, the photosensitivity resin is painted on the transparent main circuit substrate, the photosensitivity resin on the electrode on the main circuit substrate are removed, the conductive particulates are filled in the removed portion, and thus only the conductive particulates are arranged only on the electrodes.