IMPROVED INTEGRATED CIRCUIT STRUCTURES AND METHODS TO FACILITATE ACCURATE MEASUREMENT OF THE IC DEVICES

摘要

The present invention relates, in one embodiment, to an integrated circuit including a first circuit structure, a first conductive bonding pad (610a) coupled to the first circuit structure, a second circuit structure, and a second conductive bonding pad (610b) coupled to the second circuit structure. The first conductive bonding pad (610a) is arranged to be separated from the second bonding pad (610b) by a gap (614) having a gap dimension. The gap dimension is configured to be bridged by a wire bond, thereby permitting the wire bond to electrically couple the first conductive bonding pad (610a) with the second conductive bonding pad (610b) when the wire bond is coupled to the first bonding pad (610a) and the second bonding pad (610b) at the gap (614).