发明名称 Systems and methods for reducing temperature in an optical signal source co-packaged with a driver
摘要 Systems and methods for reducing temperature of an optical signal source co-packaged with a driver are provided. An optical transmitter can include a housing. The optical transmitter can include an optical signal source positioned within the housing. The optical transmitter can include a signal source driver positioned within the housing and configured to control an output of the optical signal source. The optical transmitter can include a substrate mounted on an interior surface of the housing and having a microwave waveguide coupled to it. The microwave waveguide can be configured to direct electrical signals originating outside the housing to the signal source driver. The substrate is can also be configured to limit heat transfer from the signal source driver to the optical signal source.
申请公布号 US9379819(B1) 申请公布日期 2016.06.28
申请号 US201414147134 申请日期 2014.01.03
申请人 Google Inc. 发明人 Mao Erji;Liu Hong;Urata Ryohei;Beauchemin Melanie
分类号 H04B10/00;H04B10/50;H04B10/40 主分类号 H04B10/00
代理机构 Foley & Lardner LLP 代理人 Gordon Edward A.;Foley & Lardner LLP
主权项 1. An optical transmitter, comprising: a housing; a first optical signal source positioned within the housing; a first signal source driver positioned within the housing and configured to control an output of the first optical signal source; a second optical signal source positioned within the housing; a second signal source driver positioned within the housing; and a substrate, mounted on an interior surface of the housing and having a microwave waveguide coupled thereto configured to direct electrical signals originating outside the housing to the first and second signal source drivers, wherein the substrate is further configured to limit heat transfer from the first and second signal source drivers to the first and second optical signal sources, wherein the first optical signal source and the first signal source driver are separated by a distance in the range of about 100 microns to about 300 microns, wherein the second optical signal source and the second signal source driver are separated by a distance in the range of about 100 microns to about 300 microns, wherein the first optical signal source is positioned along an edge of the optical transmitter and surrounded on at least three sides by a first trench in the substrate, wherein the second optical signal source is positioned along an edge of the optical transmitter and surrounded on at least three sides by a second trench in the substrate, wherein the first trench and second trench have respective depths smaller than a thickness of the substrate.
地址 Mountain View CA US