| 发明名称 |
IC package having non-horizontal die pad and lead frame therefor |
| 摘要 |
A multi-component integrated circuit (IC) package has a base component (e.g., an interposer) defining a base of the IC package, a plurality of die pads extending from the base and forming side walls of the IC package, one or more IC dies, each mounted on an interior surface of one of the die pads, and bond wires electrically connecting the IC dies to another component of the IC package, such as the interposer or another die. By mounting dies on non-horizontal side walls, the IC package can provide more-effective thermal dissipation than conventional 3D IC packages having stacks of IC dies. |
| 申请公布号 |
US9379035(B1) |
申请公布日期 |
2016.06.28 |
| 申请号 |
US201514850966 |
申请日期 |
2015.09.11 |
| 申请人 |
FREESCALE SEMICONDUCTOR, INC. |
发明人 |
Ge You;Lye Meng Kong;Wang Zhijie |
| 分类号 |
H01L23/52;H01L23/367;H01L23/053;H01L25/065;H01L23/495;H01L21/56;H01L23/00 |
主分类号 |
H01L23/52 |
| 代理机构 |
|
代理人 |
Bergere Charles E. |
| 主权项 |
1. A multi-component integrated circuit (IC) package comprising:
a base component defining a base of the IC package; a plurality of die pads extending from the base and forming side walls of the IC package; one or more IC dies, each mounted on an interior surface of one of the die pads; and a plurality of wires, each wire connecting a corresponding IC die to another component of the IC package, and wherein the base component is an interposer, and at least one wire connects a corresponding IC die to the interposer. |
| 地址 |
Austin TX US |
