METHOD FOR MANUFACTURING DISPLAY PANEL INCLUDING CHIP ON FILM TYPE SEMICONDUCTOR DEVICE

摘要

Disclosed is a method for manufacturing a display panel including a chip on film (COF) type semiconductor device. The method for manufacturing display panel according to an embodiment of the present invention comprises the steps of: manufacturing a COF type semiconductor device wherein one side of a semiconductor chip is formed on a film; maintaining an oxide insulator formed on the other one side of the chip by an oxidation process executed during a process for manufacturing the semiconductor device, wherein the other side of the semiconductor chip comes into contact with the rear side of a display panel; and electrically insulating the other side of the semiconductor chip and the rear side of the display panel by using the oxide insulator, wherein the display panel may be an organic light-emitting diode (OLED) display panel. The present invention is designed to provide a method for manufacturing a display panel including a chip on film (COF) type semiconductor device capable of preventing the increase in unit cost of goods and the increase in thickness of goods.