| 摘要 |
PROBLEM TO BE SOLVED: To provide a vacuum vapor deposition apparatus capable of forming a vapor-deposited film which is uniform in film thickness distribution, not to mention being capable of increasing the ratio of a flat part of a film deposition pattern and suppressing a pattern blur.SOLUTION: The present invention relates to a vacuum vapor deposition device such that an evaporation source 1 is provided with a plurality of evaporation opening parts 2 along a length of the evaporation source 1, the evaporation source 1 and a substrate 3 arranged opposite the evaporation source 1 move relatively in a direction orthogonal to the length of the evaporation source 1, and a film deposition material is jetted from the evaporation opening parts 2 to form a vapor-deposited film on the substrate 3. A pair of outer evaporation opening parts 2 provided outside among the plurality of evaporation opening parts 2 have opening end faces inclined to face outward in the length direction of the evaporation source 1 respectively, and at least one of inner evaporation opening parts 2 located inside the outer evaporation opening parts 2 has an opening end face inclined to face a length-directional center side of the evaporation source 1.SELECTED DRAWING: Figure 8 |
