发明名称 MANUFACTURING METHOD OF TRANSPARENT CONDUCTIVE SUBSTRATE AND MANUFACTURING METHOD OF ELECTRONIC DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a manufacturing method of a transparent conductive substrate, etc., capable of suppressing a variation of, as well as lowering, a surface resistance.SOLUTION: A manufacturing method of a transparent conductive substrate includes an application step of applying, on a surface of a transparent substrate, a conductive layer coating liquid at least including a metal fiber, a resin and a solvent, to deposit a coating film; and a resin removal step of removing the resin from the coating film to obtain a transparent conductive layer with the metal fiber exposed.SELECTED DRAWING: Figure 1
申请公布号 JP2016134197(A) 申请公布日期 2016.07.25
申请号 JP20150005866 申请日期 2015.01.15
申请人 DAINIPPON PRINTING CO LTD 发明人 HONMA SATOSHI;WADA MASAHIKO;IIDA MITSURU;TSUBOI TATSUYA
分类号 H01B13/00;B05D3/10;B05D5/12;G06F3/041 主分类号 H01B13/00
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