| 摘要 |
PROBLEM TO BE SOLVED: To obtain an epoxy resin composition good in moldability such as high in flwability and suppressed in burr development, capable of giving cured products low in hygroscopicity and excellent in reflow resistance, and capable of manufacturing excellently molded and highly reliabley semiconductor products in high productivity, and to obtain a semiconductor device using the above composition. SOLUTION: The epoxy resin composition comprises an epoxy resin, a curing agent and inorganic filler. In this case, the inorganic filler is such one that the average article size is <2.5μm, <=97wt.% thereof is <=25×m in particle size, and fine fused silica subjected to homogemerous mixing treatment with the epoxy resin and/or the curing agent in advanceis contained at >=1wt.%. The other objective semiconductor device is such one as to be sealed with the cured product from this epoxy resin composition.
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