| 摘要 |
PROBLEM TO BE SOLVED: To fix a module to a supporting substrate with a simple handling bonding agent, by sticking the sheet-shaped bonding agent, wherein an opening part is provided at a position in correspondence with a plurality of semiconductor modules on the first main surface of the substrate, by cutting out the sheet- shaped bonding agent provided around a protecting member and by bonding the agent to the supporting substrate. SOLUTION: A plurality of semiconductor chips are arranged at the specified interval on a substrate 4. In a double bonding-agent sheet 1, a part in correspondence with the part of a semiconductor module sealed with a resin 3 is pushed out, and an opening part 2 is formed. Then, the bonding-agent sheet 1 is stuck to a multiple module substrate 4 so that the opening part 2 is coupled with the resin sealing 3 on the substrate 4. When the substrate 4, on which the bonding agent 1 is stuck, is punched along a punching line 23, the semiconductor module with the bonding agent is formed. Finally, the semiconductor module with the bonding agent is stuck into the concave part of the module supporting substrate. The position alignment becomes easy, and the sticking is completed only in one action.
|
