| 摘要 |
PROBLEM TO BE SOLVED: To obtain a printed circuit board having a decoupled ground bus and a power bus and an extremely large decoupling capacitor by laminating a first conductor foil coated, at least on one side thereof, with a dielectric material together with a second conductor foil on the coating of the dielectric material. SOLUTION: Copper sheets 10, 14 are punched according to a clearance hole pattern on the ground plane and a copper sheet 12 is punched according to a clearance hole pattern on the hot side ASM dry coating sheets 18, 20 are then pasted onto the upper and lower surfaces of the copper sheet 12 and an ASM dry coating sheets 22 is pasted onto the lower surface of the copper sheet 14. Subsequently, these copper sheet/ASM dry coating structures are laminated together with prefabricated cores 24, 26, glass cloths 36, 38 and outer copper foils 40, 42 to produce a composite multilayer board. The composite multilayer board is then punched and processed through plating and outer circuit are made, thus completing a board having four parallel capacitive planes 44, 46, 48, 50. |
