HEAT TREATMENT APPARATUS FOR WAFER AND METHOD FOR CHARGING WAFER TO THE APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a sheet-fed heat treatment apparatus capable of keeping the heat-depression and temperature uniformity even in the case of using a wafer-supporting jig made of a quartz glass, suppressing the increase in the size of apparatus and the generation of particles and keeping high heat- insulation property. SOLUTION: This heat treatment apparatus us composed of a wafer- supporting jig 40 made of a quartz glass and supporting one or two semiconductor wafers in vertical state and a reaction vessel 50 made of a quartz glass and encircling the semiconductor wafer supported by the supporting jig to form a space for the heat treatment of the wafer. The reaction vessel is formed in the form of a flat dome having a flat face at the side of the heat-treating face of the wafer. An opaque part opacified by including bubbles or other means is present in at least a part of the extending quartz glass part 43 of the supporting jig 40 extending through the lower opening of the vessel.