| 摘要 |
PROBLEM TO BE SOLVED: To suppress the excess increase of internal temperature without changing the size of an entire data carrier package even at a high temperature when drying cleaning or cooking foods by heating by selecting a material, which has a thermal transit point within a specified range to the heat resistant temperature of an IC chip, as a filling material. SOLUTION: The material having a thermal transit point t( deg.C) of T-50<=t<=T to a heat resistant temperature T( deg.C) of the IC chip is selected as the filling material. When the thermal transit point (t) is not settled within such a range such as lower than T-50( deg.C), for example, thermal transition occurs too early and there is danger not to provide the suppressing effect of temperature increase as required. Besides, the quantity of heat to be supplied is increased by too much difference from an environmental temperature and the suppressing effect of temperature increase is lowered. When the thermal transit point (t) is higher than T( deg.C), on the other hand, it exceeds the heat resistant temperature of the IC chip without providing the suppressing effect of temperature increase. |
