Electrical interconnection method

摘要

An electrical interconnection method, where two substrates are interconnected by an electrical connection medium, includes the steps of: depositing conductive particles on the connection surface of one of two substrates which are to be interconnected; depositing paste on the connection surface of another substrate; and interconnecting the connection surfaces of the two substrates. Also, the interconnection method according to another embodiment embodiment includes the steps of: depositing conductive particles on the connection surface of one of two substrates which are to be interconnected; contacting the connection surfaces of the two substrates; and injecting paste into a gap between the two substrates to interconnect the two substrates.