发明名称 METHOD FOR MANUFACTURING SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
摘要 PROBLEM TO BE SOLVED: To improve dielectric constant, remaining polarization, hysteresis characteristics, etc., by using a target of density near theoretical value when forming a high melting point material thin film or ferroelectrics thin film on a substrate by a spattering method. SOLUTION: To a target holding means provided in a process chamber of a spattering device, a target of a high (ferro) dielectrics having density equal to or more than 90% of theoretical value is attached. A PZT film formed with a high density target (90% or more) is, compared to a PZT film formed with low density (90% or less), larger in remaining polarization 2pr, with improved electric characteristics and hysteresis characteristics, and large remaining polarization ratio is obtained. By using a high density target closer to a theoretical density of perovskite type crystal, a cluster closer to the perovskite type crystal (fine crystal) is obtained at sputtering, and the structure is maintained after film-forming.
申请公布号 JPH1056145(A) 申请公布日期 1998.02.24
申请号 JP19960208657 申请日期 1996.08.07
申请人 HITACHI LTD 发明人 KATO HISAYUKI;ABE TOSHIHIKO;NISHIHARA SHINJI;YAMAZAKI MASAHITO;YOSHIZUMI KEIICHI
分类号 H01L21/8247;C23C14/08;C23C14/34;H01L21/02;H01L21/314;H01L21/316;H01L21/8242;H01L27/108;H01L29/788;H01L29/792 主分类号 H01L21/8247
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