发明名称 |
RESIN-ENCAPSULATED SEMICONDUCTOR DEVICE WITH HEATSINK AND METHOD FOR MANUFACTURING THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device provided with a heatsink of a thin metallic plate which can ensure a sufficiently long interface with molding resin from the exposed part to the semiconductor die. SOLUTION: A heatsink 4 is formed by pressing a thin metallic plate. The heatsink 4 is provided with a lead supporting surface 19 around it, a hollow semiconductor die mounting surface 20 and an exposed protuberance on the opposite side. The heatsink 4 has a long interface with encapsulating resin 10 to reduce penetration of contaminants into the package. A rolled thin metallic plate is easy to work continuously and is relatively less expensive. A support bar 6 is connected to the heatsink 4 by caulking. An insulating sheet 7 to which no adhesive is applied is sandwiched between the heatsink 4 and leads 5. The reliability of connection is improved by eliminating the adhesive. The operations such as curing adhesive and dry-cleaning the leads can be eliminated. |
申请公布号 |
JPH1056113(A) |
申请公布日期 |
1998.02.24 |
申请号 |
JP19970137798 |
申请日期 |
1997.05.12 |
申请人 |
GOTO SEISAKUSHO:KK |
发明人 |
WATANABE NORINAGA;NISHI SHINICHI |
分类号 |
H01L23/36;H01L23/50;(IPC1-7):H01L23/36 |
主分类号 |
H01L23/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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