发明名称 Electrostatc discharge protection network
摘要 An electrostatic discharge protection network which diverts ESD stress arising between any two contact pads of an IC device, in order to prevent damage to the internal circuitry of the IC device. An ESD discharge bus is arranged around the periphery of an IC chip. Between each IC pad and the discharge bus, there is a protection circuit to directly bypass an ESD stress arising at any two IC pads. Each ESD protection circuit includes a diode, a thick-oxide device, a resistor, and a capacitor. The protection circuit is operated in snapback mode without causing breakdown. Therefore, the triggering voltage of the ESD protection circuit is lowered to the level of the snapback voltage but not to the level of the breakdown voltage.
申请公布号 US5721656(A) 申请公布日期 1998.02.24
申请号 US19960661105 申请日期 1996.06.10
申请人 WINBOND ELECTRONICS CORPORATION 发明人 WU, CHAU-NENG;KER, MING-DOU
分类号 H01L27/02;(IPC1-7):H02H3/22 主分类号 H01L27/02
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