| 摘要 |
<p>PROBLEM TO BE SOLVED: To enable a barrier layer and a coating layer out of a laminated conductive layer composed of a barrier layer, a coating layer, and a conductive main material layer on an insulating board to be lessened in thickness without deteriorating a semiconductor chip in adhesive properties or bonding properties. SOLUTION: A semiconductor device multilayer printed board 1 is equipped with a semiconductor chip mounting die pad 11 and a bonding pad 12 provided onto the surface of an insulating board 51 where an inner wiring 5 is formed and an electrode pad 13 formed on the rear of the insulating board 51, wherein the die pad 11, the bonding pad 12, and the electrode pad 11 are of laminated structure composed of a conductive main material layer 101, a barrier layer 102 of nickel or nickel alloy, and a coating layer 103 of palladium or palladium alloy successively laminated in this sequence. By this setup, a diffusion reaction is prevented from occurring between the coating layer 103, the conductive main material 101, and the barrier 102, and the barrier layer 102 and the coating layer 103 are reduced to an irreducible minimum in thickness.</p> |
