| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin packaged semiconductor laser device and its manufacturing method by which no peeling-off or breakage in the boundary face between an end face breakage prevention layer and a sealing resin is generated and stable electric and optical characteristics can be realized. SOLUTION: In this device, a laser diode chip 1 is fixed on a metallic main board 3 by means of a sub-mount 2 in which a photo diode for monitor is built in, and it is covered with a end face breakage prevention layer 5 adjacent to its light emitting face that prevents a sealing resin 6 from being broken by a laser light, and further the laser diode chip 1, a sub-mount 2, a layer 5, and a board 3 are all packaged with the resin 6. In this case, since a through hole 6a from the surface of the layer 5 to the outer surface of the resin 6 is provided, the thermal stress of the layer 5 can be suppressed. |
