| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a printed wiring board which has superior connection reliability between a blind via hole and an internal layer circuit. SOLUTION: In a method for manufacturing a printed wiring board 8, an internal layer circuit 31 is formed on the surface of a substrate 5, and then an insulation layer 6 having a blind via hole 32, which goes outward from the internal layer circuit 31, is formed on the surface of the substrate 5. In this case, an opening hole 61 which goes outward from the internal circuit 31 is formed in the insulation layer 6, and then an bottom surface metal plating layer 1 is applied to the bottom surface of the opening hole 61, and then a surface plating layer 2 is applied to the bottom surface metal plated layer 1 and the side wall of the opening hole 61, thus the blind via hole 32 is formed in the insulation layer 6. After the bottom surface metal plated layer 1 is formed, it is desirable that a catalytic layer is formed on the bottom surface metal plated layer 1 and the opening hole 61, and that a via hole plated film is applied thereafter. |
