| 摘要 |
PROBLEM TO BE SOLVED: To bond an electronic device having bumps to a board with high efficiency by providing a process for pressing the electronic device to the board while sandwiching an adhesive by means of a transfer unit so that the bumps of the electronic device bite into an electrode. SOLUTION: At first, a board 1 having electrodes 2, 3 applied with a precoat 25 of solder is coated with an adhesive 18 by means of a coater and transferred to a transfer unit. The transfer unit mounts an electronic device 4 having bumps on the board 1 and presses the electronic device 4 against the board 1 by means of a transfer head 21 so that bumps 6, 7 bite into the precoat 7. Even if the board 1 is transferred to the transfer unit, the electronic device 4 is not shifted from the board 1 because of the adhesive 18 present between the electronic device 4 having bumps and the board 1. The electronic device 4 is pressed against the board 1 while being heated by means of a thermocompression head 23 and the bumps 6, 7 are bonded to the electrodes 2, 3. Consequently, each process can be carried out using a stage for exclusive use. |
