发明名称 FERROELECTRIC MEMORY DEVICE AND MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a ferroelectric memory device and its manufacturing method. SOLUTION: An adhesive reinforcement layer 116 is formed between a lower electrode 118 of a ferroelectric capacitor and a first interlayer insulating film 110. A diffusion barrier layer 122 is formed between a ferroelectric pattern 120 of the ferroelectric capacitor and an upper electrode 124. As a result, the adhesive force between the capacitor electrode and the interlayer insulating film or between the ferroelectric pattern and the electrode can be improved. In addition, the material included in the ferroelectric pattern is prevented from diffusing into the interlayer insulating film.
申请公布号 JPH1056143(A) 申请公布日期 1998.02.24
申请号 JP19970146675 申请日期 1997.06.04
申请人 SAMSUNG ELECTRON CO LTD 发明人 TEI TOSHIN
分类号 H01L21/8247;H01L21/02;H01L21/822;H01L21/8242;H01L21/8246;H01L27/04;H01L27/06;H01L27/10;H01L27/105;H01L27/108;H01L27/115;H01L29/788;H01L29/792 主分类号 H01L21/8247
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