发明名称 MANUFACTURING METHOD OF PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE INCLUDING PRINTED CIRCUIT BOARD MANUFACTURED BY USING THE SAME
摘要 PROBLEM TO BE SOLVED: To solve a problem that surface mounting components and insertion mounting components are mounted in different steps when both of the surface mounting components and the insertion mounting components are mounted on a printed circuit board.SOLUTION: A manufacturing method of a printed circuit board includes: a step where a metal mask, in which openings are disposed at positions corresponding to lands and through holes formed on a printed circuit board, is placed on the printed circuit board; and a step where a solder paste is applied to surfaces of the lands and inner parts of the through holes through the openings.SELECTED DRAWING: Figure 1
申请公布号 JP2016143774(A) 申请公布日期 2016.08.08
申请号 JP20150018742 申请日期 2015.02.02
申请人 HITACHI LTD 发明人 USHIFUSA NOBUYUKI;NAKATSUKA TETSUYA;KATO YUKIKO;KASHIMURA TAKASHI
分类号 H05K3/34 主分类号 H05K3/34
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