| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring structure that makes wiring inductance minimal and balances current sharing among a plurality of semiconductor modules, in a three-level power conversion device that is formed from the modules.SOLUTION: Upper and lower arms and an intermediate arm of a three-level power conversion circuit are accommodated in first modules 20-1 to 20-3 and second modules 30-1 to 30-3 and the modules are proximately disposed in parallel one by one, such that a unit phase module assembly is configured. A high potential connection terminal and a low potential connection terminal that are drawn from top faces of the first modules in each of the unit phase module assemblies that are disposed proximately, are coupled by a high potential connection terminal plate 44 and a low potential connection terminal plate 42 that are common. Intermediate potential connection terminals drawn from top faces of the second modules in each of the unit phase module assemblies are coupled by a common intermediate potential connection terminal plate 43. The high potential connection terminal plate, the low potential connection terminal plate and the intermediate potential connection terminal plate are disposed proximately to each other.SELECTED DRAWING: Figure 6 |
