发明名称 WIRE-TYPE CUTTING METHOD
摘要 PROBLEM TO BE SOLVED: To contribute to improve cutting accuracy, quality and yield of a manufactured wafer-like article by using abrasive grain with a mean particle diameter of a specified range as the abrasive grain incorporated in a slurry. SOLUTION: A premix apparatus 34 comprises a feeding inlet 37 for feeding abrasive grain and oil into a prestorage tank 30, the prestorage tank 30 wherein a slurry 60 prepd. by dispersing uniformly the abrasive grain into oil in advance by stirring and mixing is stored, a stirrer 32 for stirring the abrasive grain and the oil fed in the prestorage tank 30, a liq. transferring pipe 25 for feeding the slurry into a storage tank 22 and a feeding valve 36 for the slurry. A slurry 60 prepd. by feeding the ibrasive grain with a mean particle diameter 13-15μm and the oil by a mixing ratio of the abrasive grain to the oil of about 1:1.25 into the premix apparatus 34 and stirring and mixing them, is fed into the storage tank 22 and then, a silicon ingot is cut by using a wire 6 while the slurry 60 is jetted from liq. jetting nozzles 18 and 19 by means of a liq. feeding pump 26.
申请公布号 JPH1052816(A) 申请公布日期 1998.02.24
申请号 JP19960213427 申请日期 1996.08.13
申请人 M II M C KK 发明人 ITO KUNIO;TANAKA NOBUTAKA
分类号 B24B27/06;B28D5/00;B28D5/04;(IPC1-7):B28D5/04 主分类号 B24B27/06
代理机构 代理人
主权项
地址