发明名称 Method of preventing deformation of lead frames
摘要 Based on the fact that those portions of a lead frame which are liable to undergo deformation are the to-be-nonplated portions, the to-be-nonplated portions defined around the to-be-plated portions are covered with an adhesive tape or a resin film before the lead frame is subjected to a plating treatment, whereby to prevent deformation of the lead frame from the stage preceding to the surface treating step.
申请公布号 GB2282485(B) 申请公布日期 1998.02.25
申请号 GB19940019043 申请日期 1994.09.21
申请人 * ELECTROPLATING ENGINEERS OF JAPAN LIMITED 发明人 TSUNEO * KUBOTA;KAZUHIRO * TANIGUCHI
分类号 C25D5/02;C25D7/00;H01L23/495;H01L23/50;(IPC1-7):H01L23/495 主分类号 C25D5/02
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