发明名称 |
Method of preventing deformation of lead frames |
摘要 |
Based on the fact that those portions of a lead frame which are liable to undergo deformation are the to-be-nonplated portions, the to-be-nonplated portions defined around the to-be-plated portions are covered with an adhesive tape or a resin film before the lead frame is subjected to a plating treatment, whereby to prevent deformation of the lead frame from the stage preceding to the surface treating step. |
申请公布号 |
GB2282485(B) |
申请公布日期 |
1998.02.25 |
申请号 |
GB19940019043 |
申请日期 |
1994.09.21 |
申请人 |
* ELECTROPLATING ENGINEERS OF JAPAN LIMITED |
发明人 |
TSUNEO * KUBOTA;KAZUHIRO * TANIGUCHI |
分类号 |
C25D5/02;C25D7/00;H01L23/495;H01L23/50;(IPC1-7):H01L23/495 |
主分类号 |
C25D5/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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