MANUFACTURE OF CHIP SIZE SEMICONDUCTOR PACKAGE AND LEAD FRAME THEREFOR

摘要

PROBLEM TO BE SOLVED: To easily manufacture a chip size semiconductor package. SOLUTION: Semiconductor chips 21 each have a plurality of pads 21a on the surface and are defined by separating lines 22 and formed on a wafer 20. A lead frame 30 composed of lead support parts 31 shaped to fit to the lines 22 and leads 32 disposed in a plane surrounded by the bars 31 is adhered to the top face of the wafer 20 and leads 32 are wire-bonded to the pads 21a. The upper and lower faces of the wafer 20 are molded with the base top face of each lead 32 being exposed. A conductive metal is plated on the exposed base top face of each lead 32 and the wafer 20 and lead frame are cut to form a chip size semiconductor package.