| 摘要 |
PROBLEM TO BE SOLVED: To obtain a mounting apparatus by which the tact time of a mounting operation can be shortened when a component whose three-dimensional shape inspection such as a lead levitation inspection or the like is required is mounted by a method wherein height data, in every line, obtained by a line scanning operation by means of a laser beam is used as three-dimensional image data and an image processing operation is executed to the three-dimensional image data. SOLUTION: A component 2 is moved on a 3-D sensor 8, a laser beam 44 is scanned in a direction perpendicular to the movement of the component 2, the laser beam 44 is projected on the bottom face of the component 2, the reflection of the laser beam 44 is coupled to a semiconductor position detecting element, the output of the semiconductor position detecting element is height-computed sequentially, and the three-dimensional image of the component 2 is fetched by an image memory 35. At this time, especially when a lead 45 is levitated, height data 46 with reference to the lead 45 becomes a large value as compared with that of other leads 45. By comparing the data, the three-dimensional shape inspection such as the lead levitation inspection of the lead 45 can be performed. Consequently, the tact time of a mounting operation shortened when the component 2 is mounted. |
