| 摘要 |
PROBLEM TO BE SOLVED: To improve assembling accuracy of a product and to exclude waste of material by integrating a plated layer formed by electroplating with a component placed on the layer. SOLUTION: Since an electronic circuit element 4 is placed on an electrode and/or a plated layer 3 formed on the electrode by electroplating to integrate the layer 3 with the element 4 in the state that the layer 3 is supported by the electrode, accurate assembling is conducted without impairing an accuracy of the layer 3. Since the element 4 integrated with the layer 3 is reinforced by the element 4, it is easily operated as compared with the sole layer 3, and it can be easily handled while maintaining the accuracy of the layer 3 as it is. When many plated layers 3 are planely disposed, branch portions for connecting the layers 3 is eliminated and hence a cutting operation of the branch portion is eliminated, and waste of material can be reduced as well. |
