发明名称 OPTICAL SEMICONDUCTOR ELEMENT PACKAGE AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To reduce deviation of an optical axis between an optical semiconductor element mounted and an optical fiber, and suppress deterioration in optical coupling efficiency by a method wherein a support part for fixing an external member is provided in a sidewall of a metal frame body, while being fixed to the external member by the support part. SOLUTION: An attachment support part 15 for fixing an external member 17 to a sidewall of a metal flame 11 in an optical semiconductor element package 16 is provided, and the external member 17 is fixed by the attachment support part 15. At this time, the attachment support part 15 is elastically deformed at a root 15b thereof to reduce a deformation of a metal bottom plate 12. For this reason, stress applied to the entire metal bottom plate 12 can be reduced, and positional deviation of a semiconductor laser element mounted on the metal bottom plate 12 can be reduced, and deviation of an optical axis produced between the semiconductor laser element and an optical fiber can be reduced. Accordingly, deterioration in optical coupling efficiency of the semiconductor laser element and optical fiber can be suppressed.
申请公布号 JPH1050872(A) 申请公布日期 1998.02.20
申请号 JP19970040619 申请日期 1997.02.25
申请人 FURUKAWA ELECTRIC CO LTD:THE 发明人 SAKATA MASATO;KAZAMA YUKIO;ONO KAZUTO;MURATA HIDEAKI
分类号 H01L23/02;G02B6/42;H01L31/0232 主分类号 H01L23/02
代理机构 代理人
主权项
地址