| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device and manufacture thereof, enabling the production cost reduction. SOLUTION: A semiconductor device having a lead-on-chip structure comprises a tape 13 composed of a tape base 29 and Cu foil wiring 19 of desired shape formed on the base 29. The tape 13 is fixed to a semiconductor device 11 through adhesives. Pads 14 formed on the semiconductor device 11 are connected to the wiring 19 through wires 15 and the wiring 19 of the tape 13 is connected to inner leads 12 of a lead frame, without being in contact with wires 15. |
