| 摘要 |
<p>PROBLEM TO BE SOLVED: To eliminate various kinds of waste discharged from production process, while simplifying the process by providing a protective layer covering a resistor layer up to the side end part of a board contiguous to an upper surface electrode layer. SOLUTION: A pair of upper surface or lower surface electrode layers 32, 33 composed of an Au based thin film are provided at the side part of the upper or lower surface of a board 31 and a resistor layer 34 composed of an NiCr-based thin film is provided on the upper surface of the board 31, such that it is connected electrically with the upper surface electrode layer 32. A protective layer 35 of epoxy-based resin, for example, is then provided on the upper surface of the resistor layer 34 up to the end part, abutting on the electrode 32 on the upper surface of the board 31. A side electrode layer 36 of an NiCr-based thin film is provided on the side face of the board 31, such that it is connected electrically with the upper surface electrode layer 32 and/or the resistor layer 34 and the lower surface electrode layer 33. An Ni-plating layer 37 and a solder plating layer 38 are also provided, as required, in order to ensure reliability at the time of soldering. According to the arrangement, production process is simplified, and a useful effects for protecting the environment can be attained.</p> |
