| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor device wherein a bonding wire is not disconnected readily in a bonding part wherein a bonding wire is bonded and relability in a bonding part is improved. SOLUTION: A bonding wire 31 is bonded to a bonding pad 27 provided to an inside part of a case 22 wherein an insulation wiring board 29 is put, epoxy resin 32 is applied and set to a bonding part of the bonding wire 31 and silicone gel 33 is put inside the case 22 to cover the bonding wire 31, etc. A neck part 31a of a bonding part of the bonding wire 31 is fixed by the epoxy resin 32 which is applied and set thereto and does not move. As a result, the bonding wire 31 is not disconnected readily even if strong vibration and forcible heat cycle are applied, thus improving reliability.</p> |
