发明名称 APPARATUS AND METHOD FOR RESIN-SEALING SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To reduce a material cost without waste in resin amount necessary to resin-seal by measuring granule resin weight necessary to resin-seal, and transporting introducing the granule resin to a pot of a resin introducing unit provided in a resin sealing mold. SOLUTION: A granule resin metering and supplying unit 1 for measuring a weight of granule resin and supplying a necessary weight of the resin to resin-seal to a resin case 2 is provided. Pots corresponding in number, size and pitch to pots of resin introducing units of a resin sealing mold are provided in the case 2. A resin case pot is provided in the case 2. A surface state of an inner surface of the case pot is desirably a mirror surface. When a diameter of the case pot is 13mm or more, no clogging occurs and the resin drops. A mechanism for extruding granules may be auxiliarily provided. The mechanism is an air cylinder, and mounted at an upper portion of a supply hand.
申请公布号 JPH1050745(A) 申请公布日期 1998.02.20
申请号 JP19960201759 申请日期 1996.07.31
申请人 NEC CORP 发明人 ISE HIROSHI
分类号 B29C45/02;B29C45/14;B29C45/76;B29L31/34;H01L21/56 主分类号 B29C45/02
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