| 摘要 |
<p>PROBLEM TO BE SOLVED: To make a high-density mounting of components possible, by making the inner portion of the base-material side of a non-through continuity hole into a cavity to choke one end surface of the hole only with a metallic body. SOLUTION: Mounting a component 80A having a surface on a land part having a surface which is formed on a surface external layer conductor 8B present under a non-through continuity hole 3, the lead wire of an electric component 80B with lead wires is inserted into the inside of the non-through continuity hole 3 which is connected electrically with a surface external layer conductor 8A present above the hole 3 to mount the lead wire on a board by soldering. Even when inserting the lead wire of the electric component 80B with lead wires are other terminal parts into the non-through continuity hole 3 to solder them to it, since this insertion hole is the non-through hole 3, both the wire ends of the electric components and solder fillets are prevented from protruding onto the opposite surface of the board to its part mounting surface. Therefore, another component 80A having a surface can be mounted on the land part having a surface which is formed on the surface external layer conductor 8B both present under the hole 3 and present on the opposite side of the mounted electric component 80B with lead wires to make a high-density mounting of component possible.</p> |
