| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method for manufacturing a wiring board in which a lid portion covering an electronic part placing hole formed simultaneously during the formation of outer layer circuit with copper foil etching process can be easily peeled off in the method for producing a multi-layer printed wiring board having electronic part placing holes. SOLUTION: According to this method, a copper foil 6 is adhered to a substrate 1 trough an adhesive layer 4, a multi-layer board covering the electronic part placing hole 2 with the copper foil 6 is formed, then, the copper foil 6 is subjected to an etching process, thereby forming a lid portion covering the outer layer circuit and the electronic part plating hole. This lid portion is peeled off and the electronic part placing hole is opened. At the time, a copper foil 6 subjected to an adhesion decreasing treatment is used for the copper foil surface positioned at the adhesive region of the lid portion. Also, the treating method for reducing the adhesion can smoothen the copper foil surface. Also, a mold releasing agent is applied in the treatment of reducing adhesion.</p> |
