发明名称 STRUCTURE OF LEAD FRAME FOR SEMICONDUCTOR PACKAGE
摘要 PROBLEM TO BE SOLVED: To prevent the leak of resin at molding and deformation of leads at trimming. SOLUTION: Base ends of first and second leads 20a, 20b are alternately connected to an outer frame 25 and top ends are disposed near the periphery of a paddle 23 supported through die bars 24 in the center of the frame 25. The paddle 3 and top ends of the leads 20a, 20b are buried in insulative seams 22 with the upper faces exposed. The first lead 20a has a first dam bar 21a running near to the adjacent second leads 20b, without contacting both ends, and running parallel near to the peripheral inside of the seams 22. The outer lead 20b has a second dam bar 21b a given distance toward the tip from the first dambar 21a. This bar runs near to the adjacent first leads 20a, without contacting both ends and parallel to the periphery of the seams 22.
申请公布号 JPH1050917(A) 申请公布日期 1998.02.20
申请号 JP19970124256 申请日期 1997.05.14
申请人 LG SEMICON CO LTD 发明人 DON YUU KIMU;TEKU GIYU KAN
分类号 H01L23/50;H01L23/495;(IPC1-7):H01L23/50 主分类号 H01L23/50
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