| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for bonding a thin Au bonding wire with high bonding reliability even in a very thin Au flush plating layer. SOLUTION: The method of bonding thin Au bonding wire 5 to a conductor wiring 2 having a surface Au plating layer 23 on a ceramic substrate 1 comprises forming a metallizing conductor film 21 for forming a conductor wiring 2 on the ceramic substrate 1 and Au plating later 23 of 0.2μm or less thick, removing an impurity compd. on the Au plating layer in a plasma atmosphere, and bonding the thin bonding wire 5 to this Au plating layer 23. |
