LEAD-ON-CHIP SEMICONDUCTOR PACKAGE HAVING DISCONTINUOUS ADHESIVE LAYER FORMED BY APPLYING LIQ. ADHESIVE ON LEAD FRAME AND MANUFACTURE THEREOF

摘要

PROBLEM TO BE SOLVED: To realize adhesion between a semiconductor chip and lead frame through a discontinuous adhesive layer formed by applying a liq. adhesive on the lead frame. SOLUTION: Electrode pads 112 of a semiconductor chip 100 and inner leads 122 of a lead frame are electrically connected through bonding wires 140 and sealed by seal, means. An adhesive layer 130 is formed by a liq. adhesive having a viscosity. The adhesive is continuously applied on the top faces of the leads 122 and in the entire space between them. The adhesive applied in the space between the leads 122 are naturally removed to form an adhesive layer 130 on only the surfaces of the leads 122 and pref. a wider outermost lead 122 is formed than other inner leads. To form this layer 130, the adhesive is pref. a thermoplastic resin and may be a thermosetting resin. The thermoplastic resin has a hardening temp. of about 200 deg.C and chip adhesion temp. of about 400 deg.C.