| 摘要 |
PROBLEM TO BE SOLVED: To obtain a product which hardly causes the mounting deviation and allows the bonding wire to be short enough to reduce its inductance by forming a notch at least at one corner of the cavity which mounts a semiconductor device. SOLUTION: The semiconductor device has a package 3 having a cavity 11 for housing a semiconductor device 1, the four corners of the cavity being in a corner shape. A notch 7 e.g. is formed into at least at one corner of the cavity 11. The center 41 of the cavity 11 is eccentric from that 40 of the package 3 so that the center of the device 1 and center of electrode pads 9 at the four corners are aligned with that 40 of the package 3. Thus it is possible to contact the device 1 with two sides of the notch 7, stabilize the mounting of the device 1 and reduce the wire length variation. |
