| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer transfer mechanism in which a wafer suction pad can be fixed surely to a holding plate, e.g. a pincette, for holding a wafer without causing any air leak even if a thin and lightweight holding plate is employed, and even a large and thin, and thereby flexible, wafer can be transferred surely by sucking the wafer surely onto the holding plate and securing the wafer in place. SOLUTION: The wafer transfer mechanism comprises a recess 243 communicating with an evacuating passage 244 in a pincette body 241, a suction pad 242 for sucking a wafer W by evacuation through the evacuation passage 244 while being contained in the recess 243, and a fixing pin 245 fixed to the suction pad 242. A V groove 243D for stopping the fixing pin 245 is made in the inner circumferential surface of a second recess 243B at the recess 243 and the suction pad 242 is fixed to the recess 243 through the fixing pin 245. |
