| 摘要 |
PROBLEM TO BE SOLVED: To provide an assembly of an electronic product having electromagnetic interference shielding capability. SOLUTION: A metallized flexible enclosure 50 is provided around an electronic product, such as, a printed circuit board, and the metallized flexible enclosure 50 is sealed in such a manner that an isolatable connector 20 may be easily accessed without deteriorating the completeness of sealing. Thus, an assembly is formed. The metallized flexible enclosure 50 has a plurality of polymeric material layers which provide diffusion barrier property, and a metal layer which provides diffusion barrier property and electromagnetic interference shielding capability. This multilayer sheet is so patterned as to optimize the diffusion barrier property and the electromagnetic interference shielding capability, thus enabling efficient mass production. |
