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发明名称
DIE BONDING HEAD OF DIE BONDER
摘要
申请公布号
JPH1050736(A)
申请公布日期
1998.02.20
申请号
JP19960223212
申请日期
1996.08.06
申请人
TOSOK CORP
发明人
NAKATOMI YOSHIHARU
分类号
H01L21/52;(IPC1-7):H01L21/52
主分类号
H01L21/52
代理机构
代理人
主权项
地址
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