| 摘要 |
PROBLEM TO BE SOLVED: To improve the radiation quality of a semiconductor laser device, by filling a recess, provided in a laser mount so that an opening may be located opposite a semiconductor laser chip, with a heat sink having a higher thermal conductivity than the laser mount. SOLUTION: In a semiconductor laser device, a semiconductor laser chip 1 formed out of such a compound semiconductor as GaAs, an electrode layer 12, a laser mount 2 created out of Si substrate and a heat sink 3 are fastened by thermo-compression bondings, etc., using solders, etc. A recess 2a of the laser mount 2 is a filled with a heat sink 4 formed out of copper whose thermal conductivity is higher than that of the laser mount 2. Since the thermal conductivity of the heat sink 4 is higher than that of the laser mount 2, the radiation quality of the semiconductor device can be improved in comparison with conventional ones.
|
