| 摘要 |
PROBLEM TO BE SOLVED: To reduce remarkably the resistance of a wiring layer, by providing the wiring layer having a low-resistance metal as its main substance on the surface of an insulation layer containing at least an organic resin, and by welding to each other through discharging the contact portions between the adjacent particles to each other of the low-resistance metal present in the wiring layer to give a specific value to the resistivity of the wiring layer. SOLUTION: Using a conductor ink containing both a low-resistance metal and an organic resin, wiring patterns are printed on the surface of an insulation layer containing an organic resin to form a wiring layer. When a pulse current is applied to this wiring layer, discharges are generated among the particles of the low-resistance metal. By this plasma, removing the oxide films, etc. present on the surfaces of the metallic particles, they are brought into welded states to make the metallic particles contactable with each other without any interpositions preventing their conductibilities. In this case, controlling the applied pulse current to the wiring layer, a lowered resistance not larger than 5×10<-4>Ω.cm can be realized to make the resultant resistance of the wiring layer reducible remakably.
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